hbm4

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Samsung Steps Up in AI Memory Race: Launching 12-Layer HBM3E and HBM4 Chips

Samsung announced plans to regain its lead in the high-bandwidth memory (HBM) chip arena with the introduction of a 12-layer HBM3E chip set for Q2 2025, followed by the HBM4 chips later that year. This strategic move is part of a broader effort to enhance its AI capabilities and address shareholder concerns under new co-CEO Jun Young-hyun. With the AI market booming, Samsung aims to bolster its competitive edge against strong rivals.

Mar 21

Samsung Steps Up in AI Memory Race: Launching 12-Layer HBM3E and HBM4 Chips

Tesla Accelerates into AI Hardware with HBM4 Memory Chase

In a surprising move, Tesla is seeking HBM4 memory samples from Samsung and SK Hynix to bolster its Dojo supercomputer, positioning itself as a formidable competitor to traditional tech giants like AMD and Nvidia. This venture into high-bandwidth memory (HBM) underscores Tesla's commitment to advancing AI and supercomputing capabilities, particularly for its autonomous vehicle and data center operations. Analysts predict that Tesla's entry could disrupt the $33 billion HBM market and accelerate development in AI hardware.

Dec 27

Tesla Accelerates into AI Hardware with HBM4 Memory Chase